Capabilities

Materials

electrotek-puzzle-capabilities

  • Isola 406,408,408HR,370HR,410
  • I-Tera, I-Speed
  • ITEQ IT-180
  • Polyimide
  • Rogers RO4000 series
  • Nelco 4000-29,13-13SI
  • 3M C-Ply
  • FaradFlex
  • Al Clad/ Thermally conductive

Mechanical

  • Aspect Ratio – 15:1
  • Min Drilled hole size – 0.0059”
  • PTH tolerance – +/- 0.001”
  • Min pad – 0.014”
  • Min line – ‹ 0.003”
  • Min spacing – 0.003”
  • Min board thickness – 0.008”
  • Max board thickness – 0.200”
  • S/M dam – 0.002”

Plating and Circuitry

  • Min dielectric – .002”
  • Min Cu foil – 1/8 oz.
  • Max Cu foil – 5 oz.
  • Internal Cu Max – 5 oz.
  • External Cu max – 10 oz
  • Impedance tol. – +/- 5%
  • Filled Vias
  • Blind / Buried vias
  • Laser Drill – sub-contracted

Certifications / Registration

  • MIL-PRF-31032
  • MIL-PRF-55110
  • ISO 9001-2008
  • AS9100C
  • ITAR
  • UL-94-VO, DSR

In-House Surface Finishes

  • ENIG
  • Soft (bondable gold)
  • Hard Gold
  • Sn/Pb HASL
  • Immersion Silver, OSP
  • Electrolytic Ni

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