Capabilities & Tolerances Summary
Overall Board Thickness
- Min-.012” Max-.200”
Materials
Copper Foil – ANSI/IPC-CF-150
- Std. - Type E Class 1
- HTE – Type E Class 3
Laminate / Pre-Preg
- IPC-4101
- Epoxy to 170°C Tg and Polyimide
Flatness Tolerance
- .015” to .093” - .007” in/in
- .094” to .250” - .010” in/in
- .005” in/in available
Copper Foil Thickness
- Internal Layers-.125oz. to 5oz.
- External Layers- .125oz. to 6oz.
- (UL listed to above-heavier
copper available)
Board Types Manufactured
- Rigid Double Sided
- Rigid Multilayer up to 30 layers
- Sequential Lamination
- Blind/Buried Vias
- Controlled Impedance
- Via Fill
Production Capabilities
- Up to 30 layers
- Thin Circuits - 4 layer to .012" - 6 layer to .018"
- Tight overall thickness tolerances down to +/- 5%
- Controlled Impedance / Accurate dielectric control
- Line / Space to .003"/.003"
- UL recognized for heavy copper up to 5oz. Internal, 6oz. External- heavier copper finishes available
- Drilled holes to .006" diameter
- Aspect ratio up to 15:1
- PTH’s to +/- .001 finished
- Buried / Blind Vias - Sequential lamination
- S/M dams down to .003"
- Fine pitch SMT, BGA and Micro BGA - down to .008" Pitch
- Controlled Impedance
- <0.2% return rate over 3 years
- 95% on-time 3 years average (full Qty-on dock)
- Complete DRC and DFM on all tooling including QTA’s and prototypes
